It is quite known that in ceramic PCB we have membrane and thick film option. The difference is the technology of metalization, the membrane ceramic PCB is made with DPC (direct plated copper) and the thick film ceramic PCB are using silk screen. It applys conductive paste to ceramic substrate directly, adhere with high temperature process. Two options has its own advantages and shortcomings, DPC bears low cost (<300 celsius degree), good for the use where need high precision on electric circuit.
Now lets focus on telecommunication, nowadays everybody (in most countries) has a cell phone. We know and we use it, but we barely know what is information source, information channel, information sink, etc. Next we talk about how membrane ceramic PCB works in them.
A cell phone or computer works as information source and information sink. It uses wire, or wireless, to transfer electromagnetic wave in the air or cable, received by end device. During the process of signal transfer in the air, the strength will goes weaker (signal attenuation), that's why our phone as a stronger signal in open space, lower signal in places where has walls and rooms. So it requires base station to carry and "recharge" the signal to ensure it keeps in good power.
No matter a base station or a phone, they must has a chip to receive and send data.
Now we say the era 5G comes, nearly every corner will be covered with signal because the transfer frequency is over 100 times than 4G. The chip is playing a more important role in the days coming. It must ensure the signal keeps valid while in the crazy process converting electromagnetic wave to electric signal, and it is quite important to offer an enviorment where quick heat dissipation is available to avoid over-heat chip failure.
Membrane ceramic PCB can do the job. It has two types of materials: AL2O3 and ALN. They are both made with DPC method. They are meeting the trend of chip micro-sized or station micro-sized, the circuit can be made with better tolerance which can carry stable singal transferring process. Further more, with lower dielectric constant value, it has lower signal attenuation. The heat dissipation rate for membrane ceramic PCB (AL2O3) is 15 ~ 35 W/m.k and for ALN it is 170 ~ 230 W/m.k.
The base station can be divided into macro station and micro station, which comes from the range of signal radiation. It means, the macro station has higher heat generated, ALN membrane ceramic PCB is required, for micro station with lower heat, AL2O3 membrance ceramic PCB is recommended.
For cell phone, either the wireless network module, or its computing chip and varies of sensors, the most suitable choice is ALN ceramic PCB, it can ensure the strong performance on heat dissipation.
Now matter you are looking for AL2O3 membrance ceramic PCB, or ALN membrance ceramic PCB, Chee mau can satisfy you with superior quality and great pricing.