We've been asked by our customers from time to time, especially those companies whom are new to electronic manufacturing industry, or they just buy and sell it. The questions is
What is the accuracy or tolerance of SMT and pick and place process?
Please therefore review our standard of acceptance for the circuit assembly accurancy as below
for rectangle or square components
acceptable grade 1&2
side off (A) is less or equal to 50% of component wide (W), or 50% of connecting pad width (P), use the smaller one as standard
acceptable grade 3
side off (A) is less or equal to 25% of component wide (W), or 25% of connecting pad width (P), use the smaller one as standard
for ball grid array (BGA)
standard: BGA solder ball locates in the pad center, no wide off
defect(unacceptable)
the solder ball off wide and over minimum electric gap
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