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Production Technology of PCB-Developing Stage

We've reviewed the initial stage of PCB technology progress, now let's see the development stage history.

Developing Stage

Typical PCB technologies are this stage are:

  • 1951, polyimide material in market

  • 1953, Motorola made double sided PCB with Plated Through Hole(PTH) first time; 1955, Toshiba invented technology that form copper oxide at copper foil surface, then copper-clad plate(CCL) was brought in eye. These two technologies are then used in multi-layers PCB, which increased a lot for available space for circuit layout. Then PCB is much more popular than ever before.

  • 1954, General Electronics(GE) started to use terne metal as metal conductor protect layer, which is for corrosion resistant.

  • 1960, epoxy resin fiberglass was used as substrate for PCB manufacturing in Japan

  • 1963, Hazeltine Research Inc applied patent to use PTH holes making multi-layers PCB

  • 1964, American Western Electric invented metal core PCB with high heat conductivity

  • 1965, Japanese invented CCL with FR4 and FR5 substrate

  • 1967, Robert J. Ryan from RCA applied patent about making build up multi-layers PCB(US3756891), the core idea is plated-up technology, this is the first time build up technology been used.

  • 1968, Dupont invented photopolymer dry film(Riston)

  • 1969, Sanyo invented CCL with isolated metal substrate

  • 1969, Phillips invented FPC made with polyimide

  • 1977, Mitsubishi gas chemical company invented BT resin

  • 1979, Pactel invented Pactel Law build up method

  • 1982 Glen E. Leinbach of HP America made multilayer substrate with micro blind hole and was brought to production at October of 1983.

  • 1984, NTT invented ceramic PCB with copper polyimide Act. The isolating layer is photosensitive resin.

  • 1988, Siemens invented build-up PCB with 10+ layers with microwiring substrate, aiming to use in computer, using excimer laser to make blind hole.



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