We've reviewed the initial stage of PCB technology progress, now let's see the development stage history.
Typical PCB technologies are this stage are:
1951, polyimide material in market
1953, Motorola made double sided PCB with Plated Through Hole(PTH) first time; 1955, Toshiba invented technology that form copper oxide at copper foil surface, then copper-clad plate(CCL) was brought in eye. These two technologies are then used in multi-layers PCB, which increased a lot for available space for circuit layout. Then PCB is much more popular than ever before.
1954, General Electronics(GE) started to use terne metal as metal conductor protect layer, which is for corrosion resistant.
1960, epoxy resin fiberglass was used as substrate for PCB manufacturing in Japan
1963, Hazeltine Research Inc applied patent to use PTH holes making multi-layers PCB
1964, American Western Electric invented metal core PCB with high heat conductivity
1965, Japanese invented CCL with FR4 and FR5 substrate
1967, Robert J. Ryan from RCA applied patent about making build up multi-layers PCB(US3756891), the core idea is plated-up technology, this is the first time build up technology been used.
1968, Dupont invented photopolymer dry film(Riston)
1969, Sanyo invented CCL with isolated metal substrate
1969, Phillips invented FPC made with polyimide
1977, Mitsubishi gas chemical company invented BT resin
1979, Pactel invented Pactel Law build up method
1982 Glen E. Leinbach of HP America made multilayer substrate with micro blind hole and was brought to production at October of 1983.
1984, NTT invented ceramic PCB with copper polyimide Act. The isolating layer is photosensitive resin.
1988, Siemens invented build-up PCB with 10+ layers with microwiring substrate, aiming to use in computer, using excimer laser to make blind hole.