Development of a new HDI Rigid-flex board

While Chee mau has been approached for an potential opprotunity to manufacture a complex HDL rigid-flex board for SAMSUNG devices, our engineers has been working on the prototypes these days.


the layer stack up

This board has advanced design of 12 layers and 2+N+2 high density interconnector(HDI) feature itself, also with both rigid and flex material in the same PCB. Chee mau has successfully produced some prototypes and currently in the stage of increase rate of passing.



This PCB will be used in a tablet device and it shows our ability to manufacture PCBs with high-end class.


Please send your inquiry of rigid, flex, ceramic PCB and MC PCB to us through inquiry@cheemau.com, we are happy to offer first class PCB manufacturing service to you.

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Contact

Tel: +86-28-6010-6475

Email: inquiry@cheemau.com

ADD: NO. 468 Dragon industrial  park, Chengdu, Sichuan, China.

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