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CERAMIC PCB

At Chee mau, we have front leading manufacturing technology of Ceramic PCB in China. Relying on its high heat conductivity performance and chemical stability at extreme working conditions, Ceramic PCB is getting widely used in industries such as semi-conductors, LED lighting, medical,etc.

We are offering ceramic PCB manufacturing service to global customers at quite competitive pricing, welcome to send any cooperation proposal to us.

Ceramic PCB Production Capability

General

Material           

Manufacturing Tech  

AL2O3,  ALN, Sapphire, High Borosilicate Glass

LAM (Laser Activation Metalization)

DPC (Direct Plate Copper) 

DBC (Direct Bonded Copper)

HTCC (High-termperature Co-fired Ceramic)

LTCC (Low-termperature Co-fired Ceramic)

Performance

Copper bonding force  

Heat conductivity

Warpage

>=20 N/cm2

20~27 W/m.k (96%AL2O3)

180~220 W/m.k (ALN)

27~30 W/m.k (Sapphire)

2~5 W/m.k (High borosilicate glass)

<=2% mm

Substrate

Regular panel size

120*120mm / 127*127mm / 132*132mm

140*130mm / 190*140mm

Regular panel thickness

0.254mm / 0.381mm / 0.5mm / 0.635mm 

0.8mm / 1mm / 1.2mm / 1.5mm / 2mm

Advantages

  • Higher heat conductivity

  • Matching thermal expansivity

  • Metal film layer with lower resistance

  • Good solder-ability with higher temperature

  • Low loss in high frequency condition

  • Can be assembled at high-density condition

  • Anti-cosmic rays, long durable at aerospace application

  • No oxide layer at copper layer

Industry

  • Semi conductor

  • LED Lighting

  • Automotive

  • Solar Energy

  • Power Supply

  • Photoelectric Communication

Drill

Min. drill size

Dia. taper tolerance

Drill skewing tolerance

0.075mm

~+/-10%

~+/-0.02mm

Slot tolerance

Length >=2*width

length +/-0.05mm

width +/-0.025mm

Length <2*width

length +/-0.025mm

width +/-0.010mm

Plating

Copper weight/thickness

Copper surface roughness

H/H, 1/1, 2/2, 3/3, 4/4, 5/5, 6/6, 7/7, 8/8, 9/9, 10/10 oz

<=0.3um

Circuit

Circuit para tolerance

+/-0.045mm

Min. L.W/L.S 

0.1/0.1mm

Solder mask

Thickness/trace surface

>=10um

Thickness/trace angle

Thickness/laminate

Coffer solder mask thickness

Solder mask para tolerance

>=8um

>=15um

70~120um

+/-0.045mm

Trace Min. width

Surface copoper 1oz

Surface copoper 2oz

Surface copoper 3oz

Surface copoper 4oz

Min. legend line width

0.075mm

0.1mm

0.15mm

0.175mm

0.15mm

Legend

Min. legend width

>=0.15mm

Legend para tolerance

Min. Legend dia.

Min. Legend gap

>=0.15mm

>=0.75mm

>=0.15mm

Surface Finishing

ENIG thickness

0.025~0.075um

Nickel thickness

Immersion silver thickness

Immersion tin thickness

OSP thickness

4~8um

0.2~0.5um

0.5~1.5um

0.2~0.5um

Laser profile 

Min. gap between circuit to profile

0.2mm

Cutting line para tolerance

+/-0.02mm

Left thickness

Migration precision tolerance

Cutting line gap

Profile tolerance

Cutting line width

+/-0.05mm

+/-0.025mm

+/-0.025mm

+/-0.1mm

+/-0.1mm

Pages

Contact

Tel: +86-28-6010-6475

Email: inquiry@cheemau.com

ADD: NO. 468 Dragon industrial  park, Chengdu, Sichuan, China.

© 2020 by CHEE MAU. 

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